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Product Range : |
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- PROTOTYPES
- DOUBLE SIDE
- MULTILAYERS UPTO 24 LAYERS |
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Product Specifications : |
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SPECIFICATIONS |
STANDARAD |
PROTOTYPE |
| MINIMUM CONDUCTOR WIDTH |
5 MILS/ 0.127 MM |
4 MILS/ 0.10 MM |
| MINIMUM CONDUCTOR SPACING |
5 MILS/ 0.127 MM |
4 MILS/ 0.10 MM |
| MINIMUM PLATED HOLE SIZE |
10 MILS/ 0.25 MM |
8 MILS/ 0.20 MM |
| MAXIMUM BOARD SIZE (ACTIVE) |
610 MM X 400 MM |
820 MM X 400 MM |
| MAXIMUM NUMBER OF LAYERS |
18 |
24 |
| MAXIMUM OUTER LAYER CU. THICKNESS |
4 OZ (140 Micron) |
6 OZ (210 Micron) |
| MAXIMUM INNER LAYER CU. THICKNESS |
2 OZ (70 Micron) |
3 OZ (105 Micron) |
| BOARD THICKNESS TOLERANCE |
+10 % |
+10 % |
| SMD TESTING |
20 MILS/ 0.50 MM |
15 MILS/ 0.38 MM |
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PTH-NPTH Tolerances |
PTH |
NPTH |
Hole Size |
Tol. |
Hole Size |
Tol. |
0.5-3.5 mm |
+/-0.10 mm |
< 3.0 mm |
+/- 0.10 mm |
> 3.5 mm |
+/-0.15 mm |
> 3.0 mm |
+/- 0.15 mm |
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PCB SIZE Tolerances |
Size |
Tol. |
< 150 mm |
+/-0.20 mm |
> 150 mm |
+/-0.50 mm |
Other Tolerances |
| Thickness of PCB |
+/- 10% |
| Tolerance for Track width / spacing |
+/- 20% |
| Tolerance for Finished copper thickness (Plating in hole is considered) |
> 20 micron |
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Product Finish : |
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| 1) PROTOTYPES |
2) SOLDER MASK FINISH |
LEAD FREE FINISHES
- IMMERSION SILVER
- ELECTROLESS NICKEL IMMERSION GOLD
- IMMERSION TIN
- LEAD FREE HAL |
- PHOTO IMAGEABLE LIQUID SOLDERMASK
- SMOBC( GREEN, BLACK, RED, BLUE)
- DRY FILM SOLDERMASK |
| ELECTOROLYTIC GOLD PLATING |
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| HASL |
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| CARBON PRINTING |
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| PEELABLE MASKING |
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| 3) PRODUCT RAW MATERIAL |
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- FR-4, IS 400, IS 410
- RT DUROID ( ROGERS )
- SPECIAL LAMINATES |
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